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PS22A76
TRANSFER MOLDING TYPE
INSULATED TYPE
MAXIMUM RATINGS (T j = 25°C, unless otherwise noted)
INVERTER PART
Symbol
V CC
V CC(surge)
V CES
±I C
±I CP
P C
T j
Parameter
Supply voltage
Supply voltage (surge)
Collector-emitter voltage
Each IGBT collector current
Each IGBT collector current (peak)
Collector dissipation
Junction temperature
Condition
Applied between P-NU,NV,NW
Applied between P-NU,NV,NW
T C = 25°C
T C = 25°C, up to 1ms
T C = 25°C, per 1 chip
Ratings
900
1000
1200
25
50
113.6
-20~+150
Unit
V
V
V
A
A
W
°C
CONTROL (PROTECTION) PART
Symbol
V D
V DB
V IN
V FO
I FO
V SC
Parameter
Control supply voltage
Control supply voltage
Input voltage
Fault output supply voltage
Fault output current
Current sensing input voltage
Condition
Applied between V P1 -V PC , V N1 -V NC
Applied between V UFB -V UFS , V VFB -V VFS , V WFB -V WFS
Applied between U P , V P , W P -V PC , U N , V N , W N -V NC
Applied between F O -V NC
Sink current at F O terminal
Applied between CIN-V NC
Ratings
20
20
-0.5~V D +0.5
-0.5~V D +0.5
1
-0.5~V D +0.5
Unit
V
V
V
V
mA
V
TOTAL SYSTEM
Symbol
V CC(PROT)
T C
T stg
V iso
Parameter
Self protection supply voltage limit
(Short circuit protection capability)
Module case operation temperature
Storage temperature
Isolation voltage
Condition
V D = 13.5~16.5V, Inverter Part
T j = 125°C, non-repetitive, up to 2μs
(Note 1)
60Hz, Sinusoidal, AC 1min, between connected all pins
and heat sink plate
Ratings
800
-20~+100
-40~+125
2500
Unit
V
°C
°C
V rms
Note 1: Tc measurement point is described in Fig.1.
Fig. 1: T C MEASUREMENT POINT
Measurement point for Tc
THERMAL RESISTANCE
Symbol
R th(j-c)Q
R th(j-c)F
Parameter
Junction to case thermal
resistance (Note 2)
Condition
Inverter IGBT part (per 1/6 module)
Inverter FWDi part (per 1/6 module)
Min.
-
-
Limits
Typ.
-
-
Max.
0.88
1.40
Unit
K/W
K/W
Note 2: Grease with good thermal conductivity and long-term endurance should be applied evenly with about +100μm~+200μm on the contacting surface of
DIPIPM and heat sink. The contacting thermal resistance between DIPIPM case and heat sink Rth(c-f) is determined by the thickness and the thermal
conductivity of the applied grease. For reference, Rth(c-f) is about 0.2K/W (per 1/6 module, grease thickness: 20μm, thermal conductivity: 1.0W/m?k).
Publication Date : January 2012
2
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